Course: Thermal Analysis and Microelectronic Circuits Design
Code: 3ФЕИТ12009
ECTS points: 6 ECTS
Number of classes per week: 3+0+0+3
Lecturer: Prof. Dr. Slavka Canova
Course Goals (acquired competencies): This course offers a thorough knowledge of the thermal analysis of integrated circuits and an understanding of techniques for heat distribution and heat transfer. After the completion of the course, the student will be able to make a thermal design of integrated circuits.
Course Syllabus: Introduction to thermal analysis. Thermal analysis for integrated circuits – why is so important in the electronic design? An overview of different researches in the field of thermal analysis of integrated circuits. Advanced solutions for heat distribution in integrated circuits. A case-studies of integrated circuits with good thermal design.
Literature:
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Required Literature |
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No. |
Author |
Title |
Publisher |
Year |
|
1 |
Robert Speyer | Thermal Analysis of Materials (Materials Engineering) | CRC Press | 1993 |
|
2 |
Harita Machiraju | Thermal Analysis and Design of a MEMS-based Safety and Arming System | ProQuest | 2007 |
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3 |
Weste and Harris | CMOS VLSI Design, 4th edition | Addison-Wesley/Pearson | 2010 |
